Electronic Adhesives: Thermabond®
Thermal management of electronic systems is critical to
robust design. Printed circuit boards used in aerospace and automotive
electronic assemblies operate in demanding environments with exposure
to low temperatures, high temperatures, and vibration. Our Thermabond®
electronic adhesives are a unique class of elastomeric thermal interface
materials that provide thermal-mechanical stress decoupling and
a reliable heat transfer path. With Thermabond®, adjoining components
move freely during operation -- preventing stress build-up created
by CTE mismatch. Thermabond® is available in a range of thermal
conductivities, including an electrically conductive line for ground
plane continuity, ESD grounding, and EMI shielding, and RF shielding.
A wide variety of Thermabond® products are available. The table
below summarizes the lineup, please Contact Us to discuss what would
work best for your application.
|
99A90X008 |
99A50X008 |
99A30N008 |
48991A010 |
99950N008 |
99000W008 |
99990A008 |
99510N008 |
|
A9 Thermabond |
A5 Thermabond |
A3 Thermabond |
Supported Thermabond |
Primerless E35 Thermabond |
Low Outgassing Thermabond |
Primerless Thermabond |
Original Thermabond |
Tc @ 100C
[W/mK] |
3.0 |
1.4 |
1.0 |
0.4 |
2.5 |
1.5 |
0.4 |
0.4 |
Thermal resistance
[m^2K/W] |
6.0E-05 |
9.6E-05 |
2.1E-04 |
7.1E-04 |
8.4E-05 |
4.2E-04 |
5.2E-04 |
5.7E-04 |
Shear Modulus
[psi] |
265 |
145 |
30 |
50 |
54 |
65 |
75 |
100 |
Lap Shear Strength
[psi] |
140 |
500 |
290 |
710 |
495 |
185 |
1000 |
600 |
| Bonds without primer? |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
Yes |
No |
| Bond/cure |
Platen Press |
Vacuum or Platen |
Vacuum or Platen |
Vacuum or Platen |
Vacuum or Platen |
Platen Press |
Vacuum or Platen |
Vacuum or Platen |
| Electrical properties |
Insulative |
Insulative |
Insulative |
Insulative |
Conductive |
Insulative |
Insulative |
Insulative |
| Thickness range available |
.004" and up |
.004" and up |
.004" and up |
.008" and up |
.004" and up |
.004" and up |
.004" and up |
.004" and up |
| Fiberglass reinforcement? |
No |
No |
No |
Yes |
No |
No |
No |
No |
NOTE: "xxx" at the end of the product numbers indicates product thickness in units of .001". Standard thicknesses are .008" and .015", but other thicknesses are possible. Please Contact Us for more information.
Test Methods:
All Thermabond® thermal management
products are tested to industry standard ASTM methods for key performance
measures. The links below lead to summarizes of the test methods
on the ASTM web site. Full text methods can be purchased directly
from ASTM there.
The following data present results of additional testing on Thermabond® 99510N008 and 99510N015 conducted by outside laboratories.
Outgassing
Thermabond® has been tested to
ASTM
E595 for Total Mass Loss (TML) and Collected Volatile Condensable
Materials (CVCM) from Outgassing in a Vacuum Environment by NASA
under several curing conditions. Results can be found at the NASA
Outgassing database (search for Thermabond). The data
clearly demonstrate the dependence of TML and CVCM on cure conditions.
Under vacuum at 10-7 torr, Thermabond®
gave 0.06% TML and 0.02% CVCM. These results easily met the allowable
test limits of 1.0% TML and 0.1% CVCM. When cured under these conditions,
Thermabond® is certified for space flight applications. Contact Arlon
customer service for a complete report
on Thermabond® testing for space
applications.
Volatiles by Weight
After a typical cure cycle (15 minutes at 120° C and 14 psi), Thermabond®
showed < 1% total weight loss on heating for 2 minutes at 230° C.
This is an indication of possible outgassing volume after a standard
cure.
Ionic Contamination
In many applications, ionic migration and
potential corrosion effects in long term operation are critical. To
address these concerns, Thermabond® was evaluated by an independent laboratory for the ionic contaminants listed below.
| Species |
Level |
| Sodium Anion |
< 5 ppm |
| Potassium Anion |
< 10 ppm |
| Ammonia Cation |
< 5 ppm |
| Bromide Anion |
< 5 ppm |
| Chloride Anion |
< 5 ppm |
| Fluoride Anion |
< 5 ppm |
| Sulfate Anion |
< 5 ppm |
| Nitrate Anion |
< 5 ppm |
| Acetate Anion |
< 10 ppm |
| Formate Anion |
< 5 ppm |
| 2,4 dichlorobenzene |
< 10 ppm |
Compatibility with Substrate Treatments
Thermabond®
has been successfully bonded to a broad variety of surfaces, as shown
in the table below. Contamination with oil, aromatic hydrocarbons, or
sulfur compounds are be avoided. For detailed bonding information,
please refer to our processing guides. If you have further questions about a specific application, please Contact Us.
| Heat Sink Materials and Treatments |
PCB Materials and Treatments |
| Aluminum Bright |
Polyimide |
| Aluminum Epoxy Paint |
Multi-functional Epoxy |
| Aluminum Anodized Black |
BT Epoxy |
| Aluminum Anodized Gold |
FR-4 |
| Aluminum Anodized Clear |
Ceramics |
| Aluminum Epoxy Prepreg |
Copper Foil |
| Aluminum Chromate |
Tin-Lead Solder |
| Carbon Monolithic |
HASL Surfaces |
| Ceramics |
Paladium |
| Stainless Steel, PC Steel |
Epoxy-based Solder Mask |
| Copper, CMC, CIC, Brass |
Epoxy/Acrylic-based Solder Mask |
Arlon is the industry leader and offers extensive experience and expertise in custom compounding, calendering,
and application engineering. If you don't see what you're looking for go to our
capabilities section and find out how Arlon can custom design materials and processes to meet your demanding
and complex requirements.
Challenge Us!
Let Arlon be your company's silicone development department.
The information contained herein are believed reliable, but all recommendations or suggestions are made without guarantee. You should thoroughly and independently test materials for any planned applications and determine satisfactory performance before commercialization. Furthermore, no suggestion for use, or material supplied, shal be construed as a recommendation or inducement to violate and law or infringe and patent.
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